According to a new report from Intel Market Research, the global ABF (Ajinomoto Build-up Film) Substrate market was valued at USD 4,890 million in 2024 and is projected to reach USD 9,548 million by 2032, exhibiting a robust CAGR of 10.6% during the forecast period (2025–2032). This growth is driven by increasing demand for advanced semiconductor packaging, rising adoption in...

According to a new report from Intel Market Research, the global Flip Chip Packaging market was valued at USD 32.45 billion in 2025 and is projected to reach USD 61.89 billion by 2034, growing at a robust CAGR of 7.8% during the forecast period (2026–2034). This expansion is driven by the accelerating demand for mini‑scaled, high‑performance semiconductor devices, the proliferation of...

According to a new report from Intel Market Research, the global Underfill market was valued at USD 420 million in 2024 and is projected to grow from USD 436 million in 2025 to USD 545 million by 2032, exhibiting a steady CAGR of 3.9% during the forecast period (2025–2032). This growth is driven by the relentless miniaturization and increasing complexity of electronic devices, the...